Premium 3D Black Hole Stencil for iPhone BGA Reballing
Exact precision CNC-machined aluminum alloy frame ensures flawless heat distribution during rework operations
Laser-etched high-temp resistant stainless steel template guarantees perfect solder ball alignment for X/Y/Z axis positioning
Micro-hole pattern designed specifically for iPhone logic board BGA chips with 0.15mm tolerance for professional-grade reballing
Pre-angled edges facilitate quick positioning and prevent solder bridging during manual or automated reflow processes
Essential tool for microsoldering technicians performing chip-level repairs on iPhone logic boards with repeatable accuracy
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1***m
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I like OKWISHING because when I buy the clothes they are good quality OKWISHING I Love You
Mar.12.2025
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Mar.12.2025
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Everything was fine!
Mar.29.2025
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1***m
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My experience it’s great
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QianLi 3D stencil black hole for iPhone BGA reballing
$11.98$15.08-20.56%
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