Professional iPhone Motherboard Repair Machine with Dot Matrix Technology
High-precision dot matrix heating for safe and efficient glue removal on iPhone motherboards, minimizing damage risk. Durable aluminum alloy construction with advanced temperature control (50°C–450°C adjustable) ensures consistent performance. Compact and portable design ideal for repair shops, tech workshops, and DIY enthusiasts handling delicate board repairs. Includes multiple nozzle attachments compatible with various iPhone models for versatile repair applications. Anti-slip silicone base provides stability during operation, enhancing precision for micro-soldering tasks. Ultra-fast heat-up time (under 30 seconds) boosts productivity in high-volume repair environments. Energy-efficient ceramic heating element extends lifespan while reducing power consumption. Certified for ESD safety to protect sensitive electronic components during repair processes.