Precision BGA IC Chip-Level Repair Machine for Laptop & Mobile Phone Manufacturing
High-precision automatic alignment for flawless BGA chip soldering and rework, ensuring factory-grade repair accuracy. Industrial-grade steel frame with anti-vibration design, paired with ceramic heating elements for consistent temperature control (±1°C). Multi-zone IR preheating (up to 300°C) prevents PCB warping during high-density chip replacement (e.g., iPhone CPU/GPU, MacBook logic boards). Smart vacuum suction nozzle system handles micro components (0.2mm pitch) without manual tweezers, ideal for mass-production lines. Plug-and-play modular design integrates with existing SMT assembly lines—no technician training required. Ultra-compact footprint (45x60cm) fits bench-top workshops or mobile repair stations. Includes FDA-certified lead-free solder paste compatibility for EU/NA compliance.
Typical Use:
- Smartphone motherboard reballing (e.g., Qualcomm/Samsung chips) - Laptop GPU replacement (MacBook Pro, gaming laptops) - Automotive ECU chip repairs
Why Us:
Global wholesale pricing, bulk order discounts, and 48hr direct shipping from bonded warehouses.