Professional-Grade BGA Repair Machine for Precision IC Chip Reballing

High-Precision Temperature Control with Advanced WDS620 System for flawless soldering and desoldering of IC chips.

Industrial-Grade Aluminum Alloy Construction ensures durability and heat dissipation for prolonged heavy-duty use.

Multi-Function Capability supports mobile phone, laptop, and tablet PCB repairs with adjustable nozzle for versatile applications.

Ergonomic Design features anti-slip base and lightweight frame for comfortable operation during extended repair sessions.

Smart Auto-Calibration detects component size automatically to prevent overheating damage to delicate circuits.

Wide Compatibility works with lead-free and leaded solder balls, ideal for BGA rework stations and micro-soldering.

Quick Heat-Up Technology reaches optimal working temperature in seconds, maximizing efficiency for high-volume repair shops.

Safety-Certified Components include ceramic heating elements and overcurrent protection for risk-free operation.

Complete Repair Solution includes vacuum suction tool and multiple stencil sizes for all-in-one chip reballing.

Global Compliance meets CE/FCC standards, suitable for professional technicians and electronics manufacturing facilities.