Fully-Automatic BGA Rework Station DH-A2E – Precision Laptop Mainboard Repair Solution
High-precision IR heating with PID temperature control ensures uniform heat distribution for flawless BGA chip soldering. Industrial-grade steel frame with ceramic heating elements guarantees durability and heat resistance up to 500°C. Optical alignment system with 6x magnification and adjustable X-Y-Z axis for pinpoint accuracy in chip placement. Automatic vacuum suction secures PCBs during rework, preventing misalignment. Pre-programmed temperature curves support lead-free and leaded solder profiles, ideal for repairing laptops, gaming consoles, and embedded systems. Built-in cooling fan accelerates post-soldering cooldown for efficiency. Multi-layer insulation design minimizes heat loss while protecting sensitive components. Compatible with chips up to 70x70mm, including CPU/GPU chipsets on modern motherboards. Plug-and-play operation with touchscreen interface simplifies workflow for both workshops and mass production lines. Includes anti-static tweezers and high-temperature suction pen for immediate use. Global wholesale pricing available for bulk orders—direct factory supply ensures unbeatable cost efficiency. Upgrade your repair toolkit with this industrial-grade, fully automated BGA solution.