BGA Rework Station with High-Precision Infrared Heating for Professional PCB Repair

Advanced Temperature Control System with PID Technology for Even Heat Distribution and Accurate BGA Reballing

Industrial-Grade Stainless Steel Frame and Durable Ceramic Heating Elements for Long-Lasting Performance

Customizable Nozzle Sizes and Adjustable Airflow to Handle Various Chip Sizes from 5mm to 50mm

Ideal for Electronics Repair Shops, Manufacturing Facilities, and R&D Labs Working on Laptops, GPUs, and Motherboards

High-Efficiency IR Heating with Rapid Warm-Up (Reaches 300°C in 90 Seconds) for Faster Repairs

Includes Anti-Static Tweezers, Solder Paste Jars, and BGA Stencils for Complete Rework Solutions

Best-Selling Model in Shenzhen’s Electronics Market, Trusted by Professionals for Precision and Reliability