Professional-Grade BGA Rework Station for Precision Repairs
High-precision heating with dual IR preheater and top heater ensures uniform temperature distribution for flawless BGA reballing. Industrial-grade aluminum alloy construction with ceramic heating element guarantees durability and consistent performance.
Advanced Temperature Control & Safety Features
Digital PID controller maintains ±1°C accuracy, while auto-cooling function prevents overheating. Built-in ESD protection safeguards sensitive PCB components during mobile phone and laptop motherboard repairs.
Versatile Repair Solution for Multiple Devices
Ideal for reworking BGA chips on smartphones, gaming consoles, and automotive ECUs. Includes adjustable nozzle kit (8mm–40mm) to handle diverse chip sizes from CPU to GPU.
Ergonomic Design for Efficient Workflow
Lightweight arm with 360° rotation enables one-handed operation. Integrated vacuum suction pen allows quick chip removal without damage.
Global Wholesale Advantage
Direct factory pricing with bulk discounts. Ships worldwide with certified CE/ROHS compliance. Stock available for immediate dispatch.