Professional BGA Rework Station ZM-R7220A – Precision Repair for Mobile Devices

High-Quality Construction with Premium Materials

Heavy-duty steel frame with anti-slip silicone pads ensures stability during delicate repairs. Precision-engineered heating nozzles and ceramic heating elements provide uniform temperature distribution for flawless BGA rework.

Advanced Temperature Control for Flawless Repairs

Digital PID temperature controller offers ±1°C accuracy, preventing overheating damage. Dual-zone IR preheating minimizes board warping during component removal.

Wide Compatibility for Versatile Repairs

Ideal for smartphones, tablets, and gaming console motherboards. Compatible with all BGA, QFN, and CSP chips. Specialized fixtures accommodate various PCB sizes up to 300x300mm.

Efficient Workflow for Professional Results

Integrated vacuum suction pen allows safe chip handling. LED magnifying lens provides clear visibility for micro-soldering. Quick-change nozzle system reduces downtime between jobs.

Cost-Effective Solution for Repair Shops

Industrial-grade performance at workshop-friendly pricing. Saves 40% labor time compared to manual rework. Backed by 12-month warranty for professional use.