Mijing K23pro Multi-Function Repair Fixture
Precision-engineered dual-axis three-position design for secure and flexible mobile phone motherboard repairs. High-grade aluminum alloy frame ensures durability and heat resistance during BGA chip rework. Adjustable clamps with non-slip rubber pads protect delicate PCB components. Compatible with most smartphone models, ideal for micro-soldering, reballing, and IC replacement. Compact and lightweight for professional workshops or DIY enthusiasts. Exclusive bulk pricing for global wholesale buyers—unmatched affordability without compromising quality.