High-Precision PCB/PCBA for Mobile Phone Motherboard Manufacturing
Ultra-thin multi-layer PCB with premium FR4 material ensures superior heat resistance and signal stability. Advanced SMT assembly guarantees precise component placement for high-density circuits. RoHS-compliant lead-free soldering enhances durability and eco-friendliness. Supports 5G modules, IoT devices, and compact consumer electronics. Strict IPC-A-610 Class 2/3 standards for industrial-grade reliability. Ideal for bulk OEM/ODM orders with rapid turnaround. Global wholesale pricing with no MOQ barriers.