Professional-Grade Mobile Phone Motherboard BGA Rework Station

High-precision temperature control with dual IR heating zones for flawless soldering and desoldering of BGA chips. Industrial-grade steel frame ensures stability during intensive repairs.

Advanced vacuum suction system securely holds PCBs in place, preventing misalignment. Compatible with smartphones, tablets, and microelectronics repair workshops.

Ultra-fine ceramic heating nozzles distribute heat evenly, eliminating warping risks. Includes anti-static mat and precision tweezers for delicate component handling.

Supports lead-free solder processes with ±2°C accuracy. Ideal for repairing water damage, GPU replacements, and chip-level troubleshooting in repair businesses.

Tool-free nozzle switching mechanism saves time during multi-device repairs. EU-standard insulated power cord with emergency cutoff switch for workshop safety.