Professional-Grade Mobile Phone & Laptop Motherboard Repair Machine WDS-620 with Reball IC Tools
Precision-engineered with high-grade aluminum alloy frame and anti-static ceramic heating elements for flawless BGA rework. Features adjustable temperature control (100–450°C) and ultra-fine 0.01mm nozzle for micro-soldering. Ideal for repairing cracked solder joints, GPU/CPU replacements, and IC reballing on smartphones, tablets, and laptops. Includes vacuum suction tool and stainless steel stencils for seamless chip alignment. Industrial-grade durability with rapid heat-up (under 60 sec) and auto-cooling safety. Compatible with lead-free solder, ensuring RoHS compliance. Trusted by repair shops and electronics manufacturers for high-volume PCB fixes. Lowest wholesale prices guaranteed—bulk orders available for workshops and distributors.