IR6500 V.2 Infrared BGA Rework Welding Machine

Precision Infrared Heating
– Dual-zone IR heating ensures uniform temperature distribution for flawless BGA chip rework, eliminating cold spots during soldering.
High-Grade Materials
– Robust stainless steel frame with ceramic heating elements for durability and consistent performance under heavy use.
Versatile Application
– Ideal for mobile phone motherboard repairs, laptop chip replacements, and PCB rework in professional electronics workshops.
220V Fast Operation
– Optimized for high-efficiency soldering and desoldering, reducing downtime with rapid heat-up and precise temperature control.
User-Friendly Design
– Intuitive digital controls with real-time temperature monitoring for error-free operation, perfect for both beginners and experts.
Industrial-Grade Performance
– Engineered for high-volume repair tasks, ensuring reliability for bulk processing in repair centers.
Affordable Quality
– Professional-grade equipment at wholesale pricing, backed by global logistics for fast bulk delivery.