High-Precision Smartphone Motherboard Dismantling Machine – Kaisi 303 Pro
Engineered with aerospace-grade aluminum alloy, the Kaisi 303 Pro ensures ultra-durable construction and heat-resistant performance for prolonged industrial use. Its laser-calibrated suction module guarantees zero-scratch precision, safeguarding delicate motherboard components during high-speed operations. Featuring an intelligent thermal control system, this machine automatically adjusts temperature (50°C–200°C) for seamless IC chip removal without solder residue. The modular needle tips (0.2mm–1.5mm) are interchangeable, compatible with iPhone, Samsung, and Huawei motherboard layouts. Ideal for electronics repair shops, e-waste recycling plants, and R&D labs, it boosts efficiency by 300% with its auto-sensing vacuum pump (15kPa suction force). Includes anti-static silicone mat and 6-language touchscreen interface for global technicians. Wholesale-ready: Bulk orders ship with OEM-certified toolkits and lifetime firmware updates. Unmatched value for large-scale buyers.