CHENF Mijing Knife – Precision BGA Chip Removal Tool for Professional Repair
High-precision stainless steel blade for smooth, clean cuts without damaging delicate circuits. Anti-slip ergonomic handle ensures steady control during intricate motherboard repairs. Ultra-thin 0.2mm edge designed for scraping glue and prying IC chips with minimal force. Heat-resistant ceramic coating prevents blade warping under high-temperature BGA rework. Includes replaceable blades for long-term use in phone, laptop, and PCB repairs. Perfect for removing CPU chips, cleaning solder residue, or disassembling glued components. Lightweight aluminum alloy body with knurled grip for precision in tight spaces. Essential tool for electronics technicians, soldering workshops, and DIY microsoldering projects. Bulk pricing available for repair shops and wholesale buyers.