Professional BGA Rework Station for Precision Phone Repairs
Ultra-durable aluminum alloy frame with heat-resistant ceramic components ensures long-term stability under high temperatures. Advanced PID temperature control system delivers ±1°C accuracy for flawless soldering and desoldering. Dual-zone heating with infrared preheater (lower) and hot air nozzle (upper) prevents PCB warping during repairs. Compatible with iPhone 7 Plus and most smartphones for motherboard-level fixes like chip replacement or solder reflow. Tool-free nozzle switching and ergonomic handle design streamline workflow for technicians. Includes anti-static mat and suction cup for safe component handling. Ideal for repair shops, electronics labs, or small-scale manufacturing requiring microsoldering precision.
Why Us?
Global wholesale pricing, bulk discounts, and one-stop sourcing for all repair tools. Ships worldwide with certified quality.