LUOWEI LW-SP1 High-Quality Solder Paste for Mobile Repair
Precision-formulated solder paste with optimal viscosity for seamless mobile PCB repairs. Features 138/158/183/217 alloy compositions, ensuring reliable low, medium, and high-temperature performance. Engineered with ultra-fine particle size (Type 4) for sharp print definition, minimizing bridging and voiding. Lead-free RoHS compliance enhances durability and environmental safety. Ideal for BGA reballing, SMD component replacement, and micro-soldering on smartphones, tablets, and wearables. Superior thermal conductivity prevents joint cracking under stress. Vacuum-sealed packaging maintains freshness and extends shelf life. Trusted by professionals for rapid reflow cycles and flawless adhesion. Global wholesale pricing—bulk orders unlock unbeatable value. Stock up for high-volume repair workshops today.