Precision-Crafted BGA Reballing Solution for Professional Repairs
High-performance ZM-R5860C BGA rework station ensures flawless logic board repairs with military-grade ceramic heating elements for uniform heat distribution. Industrial-grade aluminum alloy frame with reinforced steel base guarantees stability during high-temperature operations. Advanced PID temperature control (±1°C accuracy) and 16-zone infrared heating eliminate cold spots for seamless reballing of CPUs, GPUs, and phone chipsets. Includes anti-static silicone mat and vacuum suction tool for safe PCB handling. Ideal for electronics repair shops, manufacturing QC, and R&D labs working on laptops, smartphones, and gaming consoles. Compatible with lead-free solder (supports 0.15mm–0.76mm ball sizes). Tool-free nozzle swaps streamline workflow between Apple/Samsung/Huawei logic boards. Dual-layer exhaust system with activated carbon filter reduces fumes by 90%—meets EU RoHS safety standards. Ships with calibration certificate and lifetime technical support.