Professional-Grade BGA Rework Station for Precision Repairs
High-precision temperature control with PID technology ensures stable heat distribution for flawless soldering and desoldering. Industrial-grade ceramic heating elements deliver rapid, uniform heating up to 500°C for efficient BGA chip repairs. Durable stainless steel frame with reinforced insulation guarantees long-term reliability in high-intensity workshop environments. Advanced infrared preheating minimizes board warping during delicate motherboard or GPU repairs. Multi-zone independent heating system accommodates varying PCB sizes, ideal for smartphones, laptops, and gaming consoles. Integrated vacuum suction tool allows effortless component placement with micrometer-level accuracy. Smart auto-cooling function prevents thermal shock to sensitive electronics. Includes anti-static work mat and calibrated thermal sensors for workshop-grade repairs. Compatible with lead-free solder processes. Optimized for repair shops, electronics manufacturers, and IT maintenance teams. Ships with calibration certificate and multi-language manual. Bulk order discounts available for authorized service centers.