Precision Laser IC Chip Desoldering & Reballing Solution
High-precision infrared laser technology ensures accurate temperature control for delicate IC chip desoldering and reworking without damaging sensitive components. Ideal for mobile phone and laptop motherboard repairs, BGA reballing, and SMD component replacement. Industrial-grade aluminum alloy body with advanced heat dissipation design ensures long-term stability during continuous operation. Features adjustable laser intensity and spot size for versatile use across different chip sizes and solder types. All-in-one solution for professionals—eliminates the need for multiple tools with its integrated desoldering, soldering, and reballing functions. Compatible with lead-free and leaded solder, making it perfect for modern electronics repair workshops and production lines. Ultra-fast heating and precise temperature calibration reduce rework time while maintaining consistent performance. Built-in safety mechanisms prevent overheating and static damage, ensuring safe operation for high-value PCB repairs. Trusted by global wholesale buyers—direct factory pricing with bulk order discounts available. Upgrade your repair toolkit with this reliable, cost-effective workstation designed for efficiency and durability.