High-Precision Heating Platform for iPhone 12 Series
Engineered with premium SS T12A-N12 aluminum alloy for superior heat conductivity and durability. Features a polished surface with laser-etched grids for precise component alignment, ensuring safe and efficient motherboard rework. Ideal for professional repairs, including BGA reballing, IC chip replacement, and layered soldering. Compatible with iPhone 12 Mini/Pro/Max, offering uniform heat distribution to prevent PCB warping. Optimized for high-volume workshops with rapid heat-up (0-300°C in 60 sec) and auto-cooling tech. Includes non-slip silicone feet and reinforced wiring for extended lifespan. Bulk orders available at unbeatable wholesale rates—global shipping, no minimums. Upgrade your repair toolkit with industry-leading reliability.