DH-5830 Universal BGA Rework Machine – Precision Chip Removal Solution
Industrial-grade ceramic heating elements ensure uniform heat distribution for safe BGA chip removal. High-precision infrared temperature control (±2°C) prevents PCB damage during rework. Multi-zone preheating system (up to 300°C) handles large boards and complex IC packages. Ergonomic aluminum alloy frame with anti-slip base enhances stability during operation. Integrated vacuum suction arm with adjustable nozzle for effortless chip placement. Compatible with lead-free and leaded solder, ideal for smartphone, laptop, and console repairs. Quick-change nozzles (8 sizes included) fit all common BGA chips for versatile use. Silent cooling fans reduce downtime between operations in busy repair shops. Includes calibration tools and heat-resistant gloves for immediate professional use.