High-Precision 3D Reballing Stencil for iPhone X to 15 Pro Max

Crafted from durable stainless steel with laser-etched micro-holes (0.15mm tolerance) for flawless BGA solder ball alignment during motherboard repairs.

Professional-Grade Fixture Board

Hardened anodized aluminum base ensures heat resistance (up to 300°C) and prevents warping during repeated rework cycles.

Universal Compatibility

Supports 9 iPhone generations (X/XS/11/12/13/14Pro Max/15) with precisely milled locating pins for error-free PCB positioning.

Efficiency-Optimized Design

Non-stick nickel plating allows single-handed operation and eliminates solder residue buildup in high-volume repair shops.

Micro-Scale Engineering

0.02mm precision CNC machining creates perfect contact points for IC chips and connectors during reflow processes.

Industrial-Grade Durability

Reinforced titanium alloy clamping mechanism withstands 10,000+ cycles - ideal for mobile repair franchises and component suppliers.

Error-Proof Alignment System

Color-coded corner markers and magnetic retention ensure instant PCB registration without manual adjustments.