Premium 6-Layer PCB Assembly for High-Density Electronics
Ultra-thin 6-layer multilayer design ensures superior signal integrity and reduced electromagnetic interference, ideal for compact mobile devices. High-precision FR-4 material with gold-plated contacts enhances durability and conductivity.
Professional-Grade PCBA Service
Single or double-side assembly options with SMT/THT technology, supporting complex circuitry for smartphones and IoT devices. RoHS-compliant lead-free soldering for global safety standards.
Cost-Effective Bulk Solutions
Direct factory pricing for wholesale orders, minimizing per-unit costs without compromising on 2oz copper thickness or immersion gold finish. Scalable for mass production.
Versatile Application Ready
Perfect for prototyping or commercial production of mobile motherboards, wearables, and industrial control systems. Includes DFM validation for error-free manufacturing.