HotMechanic IX5 Ultra Universal Preheating Station
Precision-engineered with high-grade aluminum alloy for rapid, even heat distribution. Layered heating platform ensures consistent temperature control for delicate motherboard repairs. Advanced dot matrix design targets localized glue removal, minimizing damage to surrounding components. Ideal for phone repair professionals tackling stubborn adhesive on chips and flex cables. Universal compatibility supports a wide range of devices, from smartphones to tablets. Built-in safety features include overheat protection and auto-shutoff for risk-free operation. Perfect for micro-soldering, BGA rework, and IC chip replacements. Durable construction withstands heavy daily use in workshops and repair labs. Optimized for efficiency—cuts prep time in half compared to conventional methods. Trusted by tech repair experts for flawless, repeatable results.