Precision-engineered desoldering preheating platform with advanced temperature control for flawless iPhone motherboard repairs. High-grade aluminum alloy heating plate ensures even heat distribution and rapid thermal response. Ultra-thin ceramic insulation layer prevents component damage while maintaining optimal working temperature. Specially designed for X/11/12/13/14/15 Pro Max models with micro-adjustable support arms. Professional-grade anti-static coating protects sensitive electronic components during repair. Integrated vacuum suction system enables clean solder removal without board warping. Essential toolset for microsoldering workshops, phone repair centers, and electronics engineering labs. Military-grade power supply delivers stable performance during prolonged operation cycles. Ergonomic non-slip base allows secure positioning during intricate repair procedures. Includes calibrated thermal sensors for real-time temperature monitoring and overload protection.