2UUL Soldering Plant Tin Platform: Precision Rework Tool for Electronics Repair

High-precision temperature control ensures stable heat distribution for delicate soldering tasks on mobile phone motherboards, CPU chips, and BGA logic boards.

Durable aluminum alloy base with anti-oxidation coating provides rapid heat conduction and long-term reliability under frequent high-temperature use.

Multi-layer ceramic heating plate delivers uniform heat flow to prevent component damage during IC rework or SMD soldering operations.

Ergonomic non-slip handle design allows secure grip for intricate PCB repairs in workshops, labs, or small electronics production lines.

Compact footprint with integrated heat-resistant silicone mat protects work surfaces while accommodating micro-soldering projects and motherboard-level reflow tasks.