ZM-R720A BGA Rework Station – Precision Repair Tool for Professionals
High-precision temperature control with PID technology ensures stable soldering and rework for delicate BGA chips. Industrial-grade ceramic heating element delivers rapid, even heat distribution up to 480°C for flawless PCB repairs. Dual-zone IR preheater prevents board warping, ideal for TVs, laptops, and mobile device motherboard reballing. Heavy-duty steel frame with anti-slip silicone feet ensures stability during intensive repair sessions. Adjustable hot air nozzle (5mm–20mm) accommodates micro-sized and large IC components with precision. Real-time LCD display monitors temperature and airflow for error-free operation in workshops or labs. Ultra-quiet turbo fan provides consistent airflow without disrupting workspace environments. Includes high-quality stainless steel tweezers and solder paste for immediate professional-grade repairs. Compact, ergonomic design saves bench space while handling high-volume repair tasks effortlessly.