Premium Reballing Kit for Mobile & Laptop Repair
High-precision reballing machine with WDS620 hot air SMD BGA rework station, engineered for flawless chip-level repairs. Industrial-grade ceramic heating elements ensure even heat distribution, preventing PCB warping. Ultra-responsive digital controls with 5-stage airflow adjustment (100-600°C) for tackling PS3, PS4, or modern micro-BGA chips. Includes anti-static tweezers and high-temp solder paste compatible with lead-free alloys. Ideal for repair shops handling GPU failures, console red lights, or smartphone motherboard issues. Full kit ships ready for professional reballing—no extra tools needed. Wholesale-ready: Bulk pricing for repair centers stocking premium equipment. Global shipping, factory-direct quality.