Universal Preheating Platform for Mobile Phone Repairs
High-precision aluminum alloy heating plate ensures even temperature distribution for safe motherboard delamination. Advanced PID temperature control allows adjustable settings from 50°C to 300°C for versatile glue removal.
Efficient Multi-Layer Removal
Designed for delicate PCB and flex cable separation, reducing damage risk during screen or component replacements. Non-slip silicone mat included for secure device placement.
Rapid Heating & Auto Shutoff
Reaches target temperature in 90 seconds with overheating protection. Ideal for repair shops handling iPhone, Samsung, and other flagship models requiring board-level fixes.
Compact Professional Tool
Lightweight anodized frame with heat-resistant handles for workshop or field use. Compatible with suction cups and pry tools for complete repair workflows.
Bulk Purchase Advantage
Direct factory pricing with wholesale discounts for repair businesses stocking multiple units. Ships globally with certified CE/FCC safety standards.