High-Precision 1300W Smart Hot Air Desoldering Station

Industrial-Grade Heating System
Equipped with a 1300W ceramic heating element for instant heat-up (reaching 480°C in seconds) and ultra-stable temperature control (±2°C variance), ideal for BGA/SMD rework.
Advanced Airflow Technology
Patented vortex nozzle delivers laminar airflow (adjustable 20-120L/min) to prevent component damage, perfect for delicate PCB/motherboard repairs.
Smart Touchscreen Interface
One-touch presets for common tasks (lead-free solder, QFN chips) with auto-cooling function to prolong heater lifespan.
Professional-Grade Build
Aerospace-grade aluminum body with silicone-insulated handle for heat resistance (up to 300°C) and anti-slip grip during prolonged use.
Multi-Device Compatibility
Works seamlessly with 862D/852D++ nozzles. Includes three stainless steel tips (5mm/7mm/10mm) for phones, laptops, and automotive ECU repairs.
Safety-Certified Design
CE/FCC/ROHS compliant with ESD-safe grounding and overheat auto-shutdown.
Bulk Order Advantage
Direct factory pricing with OEM support – no middlemen, 50+ units ready for global shipping.