Precision Heating Platform for Mobile Phone Motherboards
High-precision aluminum alloy heating plate ensures uniform heat distribution, preventing damage to delicate components during repairs. Intelligent temperature control with LCD display, adjustable from 50°C to 400°C, ideal for BGA rework and IC chip soldering. Non-slip silicone mat and anti-static design protect sensitive electronics from accidental short circuits. Compact, lightweight build with foldable legs for easy storage and portability in repair workshops. Compatible with a wide range of devices, including Android smartphones and iPhone 7G-15PM models. Fast heat-up time under 3 minutes, optimized for efficient motherboard reflow and adhesive removal.