MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform

Premium Steel Mesh Construction
High-quality stainless steel stencil ensures precise solder paste application, offering durability and resistance to warping. Ideal for repeated use in professional repair environments.
Universal Compatibility
Designed for iPhone A8-A17 chipsets, Hisilicon, Qualcomm, MTK, and EMMC Android devices. Perfect for repairing smartphones, tablets, and embedded systems.
Magnetic Locking System
Strong magnetic base holds BGA chips securely in place, eliminating misalignment during reballing. Saves time and improves accuracy for flawless repairs.
Precision Laser-Cut Openings
Ultra-fine laser-etched apertures ensure consistent solder ball placement, crucial for high-density PCB repairs. Minimizes bridging and voiding issues.
Compact & Portable Design
Lightweight yet sturdy platform fits easily into repair toolkits. Essential for technicians, hobbyists, and electronics workshops.
Suitable for Advanced Repairs
Optimized for reballing, reworking, or replacing BGA components. Trusted by professionals for microsoldering and chip-level maintenance.
Bulk Order Advantage
Global wholesale pricing ensures unbeatable value for repair shops and bulk buyers. Stock up for high-volume repair operations.