Mijing Knife Mobile Phone Motherboard BGA Chip Remove Repair Tool
Precision-crafted stainless steel blade for effortless BGA chip removal without damaging delicate circuits. Ultra-thin 0.2mm edge ensures clean separation of glued components. Anti-slip ergonomic handle provides superior control during intricate repairs. Heat-resistant ceramic tip (up to 300°C) for safe PCB pad cleaning. Ideal for removing epoxy residue, reballing CPUs, or repairing smartphones, tablets, and gaming consoles. Professional-grade anodized aluminum body resists corrosion. Includes micro-grooves for glue scraping and angled design for hard-to-reach solder points. Essential for electronics workshops or DIY microsoldering. Wholesale bulk pricing available. Globally shipped with guaranteed lowest rates. Compatible with iPhone, Samsung, and other mainstream motherboard models.