Precision-engineered BGA rework station with advanced temperature control for flawless motherboard repairs

High-performance heating elements and industrial-grade ceramic nozzles ensure even heat distribution

Ultra-sensitive infrared sensors automatically adjust soldering parameters for error-free BGA chip replacement

Heavy-duty aluminum alloy frame with anti-slip base guarantees stability during intricate repair procedures

Dual-mode operation supports both automated pre-programmed cycles and manual precision adjustments

Integrated vacuum suction system securely holds delicate PCBs during component-level repairs

LCD touchscreen interface displays real-time temperature curves and thermal imaging diagnostics

Professional-grade tool for electronics repair shops, manufacturing facilities, and R&D labs

Complete with multiple nozzle attachments for various chipset sizes and lead-free solder compatibility

Certified safety features include overheat protection and emergency power cutoff mechanism