Key Features of Foxconn DH-A2E BGA Rework Station
Precision-engineered for industrial-grade PCB repair with fully automated operation, ensuring flawless BGA reballing and soldering. High-quality alloy heating elements and ceramic infrared heaters deliver uniform temperature control up to 500°C (±1°C accuracy). Advanced vision alignment system with 4K optical zoom for micron-level component placement. Compatible with boards up to 600x600mm, ideal for smartphones, servers, and automotive electronics repair. Military-grade steel frame with shock absorption, rated for 24/7 operation in demanding workshops. Includes vacuum-assisted chip placement and self-cleaning flux system to minimize human error. Exclusive Foxconn OEM certification guarantees component longevity. Bulk pricing available for repair centers and electronics manufacturers. Ships globally with DHL express logistics.