Premium WDS-700 BGA Rework Station for Precision Mobile Motherboard Repairs
High-precision temperature control with dual IR heating zones ensures even heat distribution for safe BGA chip removal/replacement. Industrial-grade stainless steel nozzles resist oxidation for long-term durability. Advanced airflow calibration prevents PCB warping during rework, ideal for delicate smartphone and tablet motherboard repairs. Quick heat-up to 480°C with ±2°C accuracy. Modular design integrates vacuum pickup, hot air gun, and preheater – perfect for repair shops and electronics manufacturers. Includes anti-static tweezers and solder paste stencils. Ultra-low pricing for bulk orders – wholesale cost advantage for professional repair toolkits. Global shipping with OEM quality assurance.