MaAnt MY-102 Mobile Phone CPU NAND Glue Removal Blade
Ultra-thin stainless steel blade with precision laser cutting for effortless glue removal under phone CPU and NAND chips. Anti-slip ergonomic handle ensures steady control during delicate motherboard repairs. Hardened titanium coating resists corrosion and extends tool lifespan, ideal for repeated BGA chip rework. Angled edge design minimizes accidental PCB scratches during glass or chip disassembly. Essential for professional repair shops tackling iPhone adhesive layers or Android motherboard servicing. Doubles as a versatile pry tool for rear glass panels without leaving tool marks. Bulk discount available for repair center toolkits – wholesale pricing guaranteed. Ships globally with factory-direct quality assurance.