Precision BGA Rework Station for Professional-Grade Soldering & Desoldering

High-precision temperature control with digital PID technology ensures stable heat distribution for flawless BGA chip removal and reballing. Military-grade aluminum alloy construction paired with ceramic heating elements guarantees durability and rapid thermal recovery.

Dual-zone infrared heating system eliminates PCB warping during intricate SMD rework, compatible with lead-free solder alloys. Features auto-sleep safety mode and ESD-safe design for sensitive electronics repair in telecom, automotive, and industrial PCB maintenance.

Includes micro-nozzle kit for 0.2mm pitch components, supporting X-ray alignment for advanced motherboard and GPU repairs. Industrial-grade vacuum pump delivers 75Hg suction for clean desoldering without pad damage.

Optimized for high-volume workshop use with 24/7 continuous operation capability. Meets IPC-7711/7721 standards for commercial electronics rework. Ships with FDA-certified lead-free solder paste and premium stainless steel tweezers.

Global wholesale pricing available for bulk orders with same-day dispatch from bonded warehouses. OEM customization options include voltage conversion kits for international workshop compatibility.