Precision-Crafted NAND Glue Remover Tool Set for Professional Mobile Repair
High-quality stainless steel blades ensure durability and corrosion resistance for long-term use in delicate chip removal. Ultra-thin 0.2mm design allows precise scraping without damaging motherboard circuits. Ergonomic non-slip handles provide superior control during BGA rework or NAND chip repairs. Ideal for removing hardened epoxy, adhesive residue, and underfill materials from smartphones and tablets. Heat-treated blades maintain sharpness even under high-temperature repair conditions. Complete set includes multiple angled tools for accessing tight spaces around soldered components. Essential kit for professional technicians performing microsoldering, data recovery, or board-level repairs on modern compact devices. Mirror-polished surfaces prevent static buildup during sensitive electronic work.