Professional-Grade Mobile Welding Equipment WDS-700 BGA Rework Station

Precision Soldering for Mobile Motherboards
Engineered with high-precision temperature control (±1°C accuracy), the WDS-700 ensures flawless BGA reballing and IC chip soldering. Its ceramic heating element delivers rapid, even heat distribution for damage-free repairs.
Industrial-Grade Durability
Constructed with aerospace-grade aluminum alloy frame and reinforced silicone wiring, this station withstands heavy daily use. The anti-static mat and ESD-safe tweezers prevent circuit damage during delicate operations.
Smart Auto-Calibration System
Features automatic nozzle alignment and IR preheater (50-450°C adjustable) to handle multilayer PCBs. The digital airflow regulator (0-120L/min) prevents warping on thin smartphone boards.
Multi-Device Compatibility
Optimized for iPhone logic boards, Android SoC replacements, and tablet GPU repairs. Includes micro-soldering tips (0.2mm-1.5mm) for flex cable connectors and QFN components.
Workshop-Ready Performance
Ideal for electronics repair shops, manufacturing QC departments, and vocational training centers. The compact footprint (320x280mm) fits crowded workbenches while delivering industrial power output (900W).
Global Compliance & Safety
Certified with CE/RoHS standards, featuring overheat protection and dual-circuit emergency shutdown. Compatible with 110V-240V voltage for worldwide use.
Bulk Purchase Advantage
Direct-from-factory pricing with wholesale discounts for 10+ units. Ships with OEM toolkit (stainless steel solder paste jar, no-clean flux pen, and titanium desoldering wick).