Professional-Grade BGA Rework Station for Precision Chip Repair

Infrared Heating Technology
Equipped with advanced infrared heating for uniform temperature distribution, ensuring safe and efficient BGA chip removal and reballing without damaging sensitive components.
Automatic Temperature Control
Precision PID temperature control system maintains stable heat levels (up to 500°C), preventing overheating and ensuring consistent soldering results for delicate PCB repairs.
Versatile Nozzle Compatibility
Includes multiple nozzle sizes (customizable) to fit various BGA chip dimensions, making it ideal for smartphones, laptops, gaming consoles, and industrial electronics.
High-Stability Work Platform
Features a robust aluminum alloy base with vacuum suction to secure PCBs during rework, minimizing movement for flawless chip alignment and placement.
Smart Safety Features
Auto-cooling system and emergency shutoff prevent thermal damage, while the ergonomic design reduces operator fatigue during prolonged use.
Industrial & Hobbyist Use
Perfect for repair shops, electronics manufacturers, and DIY enthusiasts needing reliable, high-precision BGA rework for modern compact devices.