Key Features of Qianli Super Cam X Gen 3 Motherboard Fault Analyzer
Advanced 3D infrared thermal imaging for precise PCB and IC fault detection in mobile phone repair. High-resolution sensor captures minute temperature variations to identify short circuits, overheating components, and faulty connections instantly. Durable aerospace-grade aluminum housing with shock-resistant design ensures longevity in demanding repair environments. Ultra-precise germanium lens delivers accurate thermal readings without distortion. Supports real-time image analysis via USB or wireless connectivity, compatible with Windows and macOS. Ideal for professional repair shops, electronics manufacturers, and component-level diagnostics. Includes proprietary diagnostic software with auto-calibration and multi-layer PCB scanning modes. Saves repair time by 60% compared to traditional multimeter testing. Exclusive bulk pricing available for wholesalers and repair center chains. Global shipping with guaranteed lowest industry rates for high-volume orders.
Applications:
Smartphone motherboard repair, IC failure analysis, circuit board quality control, and electronics R&D.