FORWARD FW-HA01 Hot Air Desoldering Station – Precision & Efficiency for Professional Repairs
High-precision temperature control with digital display ensures accuracy (±2°C) for delicate PCB and motherboard repairs. Ceramic heating element delivers rapid heat-up (30 sec to 400°C) and stable airflow (120L/min) to prevent component damage. Ergonomic lightweight design with anti-slip grip reduces fatigue during prolonged use. Includes 3 interchangeable nozzles (5mm/8mm/10mm) for versatile applications: smartphone micro-soldering, laptop IC chip removal, and automotive electronics repair. Industrial-grade aluminum alloy housing with heat-resistant coating ensures durability. Compatible with lead-free solder and BGA rework. Backed by global wholesale pricing for bulk orders – trusted by repair shops worldwide.