High-Precision 22-in-1 Multi-Functional Reballing Platform

Designed for iPhone X-15 Pro Max motherboard repairs with ultra-flat anodized aluminum base for heat resistance and stability. Features modular alloy pillars with laser-etched measurement markers for millimeter-level accuracy during BGA rework.

Professional-Grade Anti-Static Work Surface

Military-grade ESD-safe coating prevents circuit damage during soldering. Reinforced steel locking clamps secure boards up to 9x9 inches with zero flex, ideal for micro-soldering on A12-A17 chips.

Smart Ergonomic Design for Repair Shops

Interchangeable brass nozzle adapters fit all standard hot air stations. Includes magnetic component trays and silicone heat shields for simultaneous multi-device repairs.

Industrial-Strength Durability

CNC-machined titanium alloy hinges withstand 100,000+ open/close cycles. Pre-installed ceramic insulation pads protect temperature-sensitive components during prolonged reballing sessions.

Complete Repair Ecosystem Compatibility

Works seamlessly with JBC, Quick, and Hakko equipment. Pre-aligned solder ball jigs included for 0.25mm/0.3mm/0.45mm pitch ICs - no calibration needed for common iPhone logic board repairs.