FORWARD 2024 Premium Temperature Control Hot Air Gun for Mobile Phone Repair FW-BF01
Precision-engineered with industrial-grade ceramic heating elements for rapid heat-up and uniform airflow distribution. Adjustable temperature range (100°C-600°C) with ±2°C accuracy for delicate PCB repairs or heavy-duty solder reflow. Ergonomic anti-slip grip and lightweight aluminum body ensure fatigue-free operation during prolonged use. Includes two stainless steel nozzles (5mm/8mm) for targeted heat application on micro-components like BGA chips or adhesive removal. Ideal for electronics workshops, smartphone refurbishing, and DIY hobbyists requiring professional-grade performance at wholesale pricing. Ships with a 3-year warranty and bulk-order discounts for repair businesses. *Note: Compatible with lead-free solder and conforms to CE/RoHS safety standards.*