AMAOE 4-in-1 Middle Layer Reballing Stencil Kit for iPhone 12 Series
Precision-engineered magnetic positioning base ensures flawless alignment for efficient BGA reballing. High-quality stainless steel stencil resists warping under heat, guaranteeing consistent solder ball placement. Universal compatibility covers iPhone 12, 12 Pro, 12 Pro Max, and Mini models in a single kit. Optimized for repair shops and microsoldering professionals, it streamlines motherboard-level repairs with rapid, error-free chip reinstalls. Durable laser-cut apertures prevent solder bridging, while the anti-slip design enhances stability during rework. Save time and reduce waste with this all-in-one solution—ideal for high-volume refurbishing or precision repairs. Bulk pricing available for wholesalers and repair centers.