Premium High-Temperature PCB Fixture for Precision Phone Repairs

Universal Compatibility – Securely holds all smartphone motherboards during soldering, glue removal, and component replacement with adjustable clamps for various sizes.

Industrial-Grade Heat Resistance – Reinforced fiberglass base withstands continuous 300°C+ temperatures for prolonged BGA rework without warping or degradation.

Anti-Slip Silicone Pads – Embedded non-abrasive pads prevent PCB scratches while ensuring firm grip during high-precision micro-soldering tasks.

Ergonomic 360° Rotation – Tool-free swivel base enables multi-angle access to repair points, optimizing workflow for IC replacements or jumper wire repairs.

Heavy-Duty Aluminum Frame – CNC-milled alloy construction offers vibration-free stability for delicate trace-level repairs under microscopes.

Essential for:

- Professional repair shops handling chip-level board reflow

- Hobbyists performing screen adhesive removal

- Microsoldering training workshops requiring repeatable positioning