Precision CNC-machined aluminum alloy body ensures durability and high rigidity for stable grinding performance

High-speed spindle with diamond-coated bits delivers ultra-fine 0.01mm grinding accuracy for delicate IC chips

Specialized anti-static design protects sensitive NAND/CPU/EEPROM components during motherboard repair

Multi-axis positioning system allows 360° adjustable angles for iPhone 6-14 Pro Max logic board IC removal

Interchangeable ceramic heating nozzle (included) enables safe iCloud-locked chip desoldering at controlled temperatures

Laser-calibrated depth control prevents over-grinding damage to multilayer PCBs during chip decapsulation

Professional-grade vacuum suction system maintains clean work area by collecting metal particles in real-time

Complete kit includes tungsten steel scrapers, magnification loupes, and anti-slip motherboard clamps

Used by certified technicians for data recovery, factory resets, and bypassing locked Apple devices