Mobile Phone Repair Fitting Motherboard Layer X15 Tin Planting Intelligent Disassembly and Soldering Station
High-precision temperature control with advanced PID algorithm ensures stable soldering for delicate motherboard layers. Premium ceramic heating element and reinforced steel nozzle provide durability and even heat distribution. Integrated intelligent tin planting function simplifies BGA reballing and component replacement for all phone models. Anti-static design with ESD-safe materials protects sensitive electronics during repairs. Multi-scenario application: ideal for micro-soldering, chip replacement, and PCB repairs in professional workshops or DIY projects. Compact yet powerful design saves workspace without compromising performance. Ultra-responsive touch panel with customizable presets for common phone brands. Includes auto-sleep mode for energy efficiency and safety. Compatible with lead-free solder for eco-friendly repairs. Engineered for precision – surgical-grade stainless steel tips and industrial-grade wiring ensure long-term reliability. Direct wholesale pricing with bulk order discounts available.